We provide the surgical execution required to clear technical debt and achieve production readiness. Optimized for capital efficiency and engineered to survive VC due diligence.
01 // Hardware Engineering
PCB Design & Fabrication
From initial schematics to production-ready prototypes, we meticulously engineer high-density PCBs optimized for signal integrity and manufacturability across complex chipset platforms.
→ Comprehensive stack-up optimization using industry-standard eCAD
→ Rapid iterative prototyping with detailed 3D design validation
→ Strategic component sourcing to mitigate supply chain risk
→ Rigorous pre-compliance testing for FCC, CE, and UL certification
02 // Low-Level Logic
Firmware & Systems Architecture
Expert bare-metal and RTOS development designed for mission-critical reliability and optimized power consumption in resource-constrained environments.
→ Ultra-low power firmware architecture to maximize battery life
→ Multi-protocol wireless integration (LTE-M, NB-IoT, BLE 5.x)
→ Clean, modular C/C++ codebases built for scale and auditing
→ Senior-led technical debt remediation and reverse engineering
03 // Signal Path
IoT Platform Development
Leveraging our proprietary SDK, we deploy resilient end-to-end IoT stacks with low-latency command response and secure cloud-to-edge connectivity.
→ Guaranteed near real-time response times (< 150ms)
→ Cross-platform SDK support for Android, iOS, and embedded Linux
→ Rapid cloud provisioning and secure OTA update infrastructure
→ Scalable data orchestration for global device fleets
04 // Interface Layer
Mobile Systems Integration
High-performance mobile applications built specifically to interface with complex hardware via Bluetooth, WiFi, or Cloud gateways.
→ Native iOS & Android development for high-frequency data handling
→ User-centric UX architecture optimized for device management
→ Seamless hardware provisioning and pairing workflows
→ Full lifecycle support from concept to App Store approval
05 // Physical Architecture
Mechanical & Industrial Design
Engineering precise physical enclosures that balance industrial aesthetics with rigorous DFM (Design for Manufacturing) standards.
→ Production-ready injection molding and CNC machining workflows
→ Expert material selection to optimize thermal and RF performance
→ High-fidelity 3D validation and rapid physical prototyping
→ Environmental sealing (IP-rating) and structural stress analysis
06 // Scale
Internal PCBA & Assembly
Our dedicated assembly division provides the surgical precision required for low-to-mid volume production and high-complexity prototyping.